The Heat Is On

Rising demand for data, internet access, and bandwidth has increased the need for thermal management. Advanced and innovative component materials provide next-level heat dissipation, helping organizations reach their goals of improved reliability, performance, and cost management.

Selecting the right thermal materials for routers, switches, and circuit boards is essential to reducing heat and realizing the full potential of tomorrow’s 5G, Wi-Fi 6, and 400 GbE data transmission rates. 

Download the white paper to learn more!